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A Tale of Two Fabs
- This article, published in an industry-newsletter (the Bartlett Bay Newsletter), discusses the protocols for cleanroom procedures and benefits for wafer yields.
- This article, published in an industry-newsletter (the Bartlett Bay Newsletter), discusses the protocols for cleanroom procedures and benefits for wafer yields.
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Science: Pontifications
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A Tale of Two Fabs
Not long after the introduction of minienvironments for 300mm-semiconductor processes, minienvironment manufacturers promised ISO Class 1 or 2 enclosures that isolate the product from the main source of cleanroom particulates: people! Consequently, some semiconductor manufacturers believed these claims and relaxed their cleanroom gowning standards; others were a little more skeptical.
Having conducted numerous airborne particle tests within different 300mm fabs, data shows that relaxing cleanroom-gowning standards will affect wafer yields. Conversely, the semiconductor fabs that still employ ISO Class 4 or 5 (Fed. Std 209E Class 10 or 100) gowning procedures, can maintain higher wafer yields.
I do not think anyone will argue against the value of minienvironments, but comprehensive data has shown that product wafers suffer significant die kills when cleanroom gowning procedures are relaxed.
(continued)
Not long after the introduction of minienvironments for 300mm-semiconductor processes, minienvironment manufacturers promised ISO Class 1 or 2 enclosures that isolate the product from the main source of cleanroom particulates: people! Consequently, some semiconductor manufacturers believed these claims and relaxed their cleanroom gowning standards; others were a little more skeptical.
Having conducted numerous airborne particle tests within different 300mm fabs, data shows that relaxing cleanroom-gowning standards will affect wafer yields. Conversely, the semiconductor fabs that still employ ISO Class 4 or 5 (Fed. Std 209E Class 10 or 100) gowning procedures, can maintain higher wafer yields.
I do not think anyone will argue against the value of minienvironments, but comprehensive data has shown that product wafers suffer significant die kills when cleanroom gowning procedures are relaxed.
(continued)
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